Degree of conversion of adhesive systems light-cured by LED and halogen light

This study evaluated the effect of blue light emitting diode (LED) and quartz tungsten halogen (QTH) on the degree of conversion (DC) of an etch-and-rinse Single Bond adhesive system (SB) and a mixture composed of primer solution and resin bond from Clearfil SE Bond self-etching adhesive system (CB) using Fourier transform infrared analysis (FTIR). Adhesives were applied to potassium bromide pellet surfaces and FTIR analyses were performed before and after photo-activation for 10 s with either LED (Freelight 1 - 400 mw/cm²) or QTH (XL 3000 - 630 mw/cm²) light-curing units (n=8). Additional FTIR spectra were obtained from photo-activated samples stored in distilled water for 1 week. The DC was calculated by comparing the spectra obtained from adhesive resins before and after photo-activation. The results were analyzed by two-way split-plot ANOVA and Tukey's test (p<0.05). Both adhesive systems exhibited low DC ( percent) immediately after photo-activation (SB/QTH: 18.7 ± 3.9; SB/LED: 13.5 ± 3.3; CF/QTH: 13.6 ± 1.9; CF/LED: 6.1 ± 1.0). The DC of samples light-cured with LED was lower than DC of those light-cured with QTH, immediately after light curing and after 1 week (SB/QTH: 51.3 ± 6.6; SB/LED: 50.3 ± 4.8; CF/QTH: 56.5 ± 2.9; CF/LED: 49.2 ± 4.9). The LED curing unit used to photo-activate the adhesive resins promoted lower DC than the QTH curing unit both immediately after light curing and 1 week after storage in water.

Este estudo avaliou a influência de sistemas de fotoativação no grau de conversão (GC) de sistemas adesivos por meio da análise infravermelha transformada de Fourier (FTIR). Os sistemas adesivos Single Bond (SB) e Clearfil SE Bond (CF) foram aplicados em pastilhas de brometo de potássio e fotoativados com luz halógena (XL 3000 - 630 mw/cm²) (QTH) e LED (Elipar Freelight 1 - 400 mw/cm²) por 10 s (n=8). Foram obtidos espectros de FTIR antes e imediatamente após a fotoativação, e tambem após 1 semana de armazenamento em água destilada. Calculou-se o GC comparando-se a razão entre os picos das bandas dos espectros, antes e após a fotoativação. Os resultados de GC foram submetidos à ANOVA e ao teste de Tukey (p<0,05). Para ambos os sistemas adesivos, o GC ( por cento) obtido imediatamente após a fotoativação com LED foi inferior ao obtido utilizando-se QTH (SB/QTH: 18,7 ± 3,9; SB/LED: 13,5 ± 3,3; CF/QTH: 13,6 ± 1,9; CF/LED: 6,1 ± 1,0). Após uma semana foi observado um aumento significativo no GC de todos os grupos, porém os valores dos grupos fotoativados com LED mantiveram-se inferiores aos obtidos com QTH (SB/QTH: 51,3 ± 6,6; SB/LED: 50,3 ± 4,8; CF/QTH: 56,5 ± 2,9; CF/LED: 49,2 ± 4,9). O GC dos adesivos fotoativados com LED foi inferior ao observado após fotoativação com QTH, imediatamente após fotoativação como após 1 semana de armazenamento em água.

Influence of curing accelerator for cyanoacrylate glues on physical properties of adhesive resins

The objectives of this study were to evaluate the effect of a curing accelerator (CA) on the ultimate tensile strength (UTS) and degree of conversion (DC) of two adhesive systems, Single Bond and Clearfil SE Bond, as well as to identify the composition of the CA hour-glass adhesive resin samples with a cross sectional area of 0,8 mm² at the "neck" were tested in tension using a Universal Testing Machine. Fourier transform infrared spectroscopy (FTIR) was used to analyse thin films of each adhesive resin. All samples were stored in the dark for 24 hours before they were tested. During the UTS and FTIR analyses, the contact of the CA with samples was either avoided or not. The gas chromatography mass spectrocopy (GC-MS) and the nuclear magnetic resonance (NMR) analyses determined the molecular weight and structure of the CA. UTS and DC were analyzed by ANOVA and Tukey's test at 95% of confidence. The use of the CA did not affect the UST (p=0.5996) but increased the DC of the samples (p<0.0001). The compound identified by GC-MS and NMR was N-dimethyl p-toluidine. The application of CA in microtensile bond strength methodology raises concern regarding its effects on poorly polymerized adhesive systems.